JPH0536299Y2 - - Google Patents
Info
- Publication number
- JPH0536299Y2 JPH0536299Y2 JP10891188U JP10891188U JPH0536299Y2 JP H0536299 Y2 JPH0536299 Y2 JP H0536299Y2 JP 10891188 U JP10891188 U JP 10891188U JP 10891188 U JP10891188 U JP 10891188U JP H0536299 Y2 JPH0536299 Y2 JP H0536299Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip electronic
- electronic component
- printed
- resin
- large chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 15
- 230000008646 thermal stress Effects 0.000 description 8
- 239000004020 conductor Substances 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10891188U JPH0536299Y2 (en]) | 1988-08-19 | 1988-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10891188U JPH0536299Y2 (en]) | 1988-08-19 | 1988-08-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0231176U JPH0231176U (en]) | 1990-02-27 |
| JPH0536299Y2 true JPH0536299Y2 (en]) | 1993-09-14 |
Family
ID=31344686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10891188U Expired - Lifetime JPH0536299Y2 (en]) | 1988-08-19 | 1988-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0536299Y2 (en]) |
-
1988
- 1988-08-19 JP JP10891188U patent/JPH0536299Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0231176U (en]) | 1990-02-27 |
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